PRODUCTS
SWA “UV” Laser series for R&D
Laser annealing equipment
A highly versatile manual machine that uses the optical system of the SWA-20US, which has a rich track record in mass production.
Application example) SiC ohmic contact generation, activation, etc.
Manual machine suitable for development and low-volume production.
Equipped with a UV laser + OPTSWING (high speed scan) + process chamber to achieve high quality processes.
*If you require a light source other than UV laser, please contact us separately.
Application example) SiC ohmic contact generation, activation, etc.
Manual machine suitable for development and low-volume production.
Equipped with a UV laser + OPTSWING (high speed scan) + process chamber to achieve high quality processes.
*If you require a light source other than UV laser, please contact us separately.
Features
Small footprint design
High-speed scanning using OPTSWING
Achieves high throughput by scanning the beam.
Compatible with 8 inch wafers
Capable of processing wafers from small pieces to 8 inches.
Top hat beam
Ensures excellent in-plane uniformity.
Simulation technology
Optimization of annealing conditions is possible through temperature simulation.
Process atmosphere control
Various monitoring functions (beam shape, etc.)
Specification
| Model | SWA-20US-M | |
|---|---|---|
| Wafer Size | 〜φ150mm (6in) | ◯ |
| Laser | UV-YAG Laser | 7W |
| Beam Size | FWHM | φ80um |
| Process Atmosphere | N2 / Air | |
| Process temperature | Room Temperature | |
| Wafer Handing | Automatic | |