PRODUCTS
SWA “Green/Hybrid” Laser series
Laser annealing equipment
High-performance laser annealing equipment that supports deep activation and double-pulse processes
Application example) IGBT backside activation
This is a hybrid annealing device equipped with a solid-state laser and a long wavelength laser that enables a unique double-pulse process. Equipped with the characteristics of solid-state lasers, such as high repetition rate, high pulse energy stability, maintenance free, and compact design, it facilitates the development of next-generation processes in the semiconductor field.
Application example) IGBT backside activation
This is a hybrid annealing device equipped with a solid-state laser and a long wavelength laser that enables a unique double-pulse process. Equipped with the characteristics of solid-state lasers, such as high repetition rate, high pulse energy stability, maintenance free, and compact design, it facilitates the development of next-generation processes in the semiconductor field.
Features
Deep activation
Activation up to 7μm is possible.
High pulse energy stability
Equipped with energy feedback function. Achieved in-plane uniformity σ<=1%.
Double pulse control further controls temperature distribution and time in the depth direction
Optimization of annealing process is possible even under temperature constraints.
Maintenance-free solid-state laser enables production at high operating rates
Compared to gas lasers, running costs can be significantly reduced.
Compact laser oscillator
It is possible to save space in the equipment installation area.
70μmt thin wafer transfer
Specification
| Model / Model | SWA-20GD | SWA-20GDA | SWA-90GD | SWA-90GDA | SWA-93GD | SWA-93GDA | |
|---|---|---|---|---|---|---|---|
| Wafer Size | 〜φ200mm (8in) | ◯ | - | ||||
| φ300mm (12in) | - | ◯ | |||||
| Laser | DPSS 20Wx2 | 20mJ@1kHz | - | ||||
| DPSS 75Wx2 | - | 25mJ@3kHz | |||||
| QCWL 500W | - | 80mJ@3kHz | - | 80mJ@3kHz | - | 80mJ@3kHz | |
| Beam Size | Width (FWHM) | 0.25mm | 0.3mm | 0.3mm | |||
| Length (FWHM) | 2.5mm | ||||||
| Process Atmosphere | N2 / Air | ||||||
| Process temperature | Room Temperature | ||||||
| Wafer Handing | Automatic >70umt | ||||||